IMMERSEKOOL to Exhibit AI Data Center Liquid Cooling Solutions at DATA CENTER KOREA 2026
IMMERSEKOOL will participate in DATA CENTER KOREA 2026, taking place from November 4–6, 2026 at aT Center in Seoul.
As AI servers become denser and rack power levels continue to rise, liquid cooling is rapidly becoming a critical part of next-generation data center infrastructure.
At the exhibition, IMMERSEKOOL will present its Direct-to-Chip (D2C) liquid cooling infrastructure and component solutions for AI data centers.
Key solutions to be introduced include:
- Rack manifold and cooling distribution solutions for AI data centers
- OCP-based quick disconnect coupling solutions
- EPDM liquid cooling hose kits
- High-flow coolant piping and connection solutions
- Integrated liquid cooling components between server racks and facility piping
Beyond individual components, IMMERSEKOOL is developing an integrated approach connecting CDU systems, rack manifolds, hoses and quick couplings to support practical AI data center liquid cooling deployments.
DATA CENTER KOREA 2026 will bring together technologies covering high-density infrastructure, AI data center power systems, AI Factory infrastructure, and next-generation cooling and power solutions.
DATA CENTER KOREA 2026
Date: November 4–6, 2026
Venue: aT Center, Seoul, Korea
Customers and partners interested in AI data center liquid cooling, rack manifolds, hose kits and quick coupling applications are welcome to meet the IMMERSEKOOL team during the exhibition.