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2026 Data Center Summit Korea

2026 Data Center Summit Korea

Date: May 27, 2026
ImmerseKool will participate in the 2026 Data Center Summit Korea, taking place on Monday, June 1, 2026, at the COEX Grand Ballroom. At this event, ImmerseKool will showcase its so…
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Thank You for Visiting Us at HVAC KOREA 2026

Thank You for Visiting Us at HVAC KOREA 2026

Date: May 19, 2026
Thank you for your interest in IMMERSEKOOL AI Data-Center Liquid Cooling Solution Newsletter Body Dear Customers and Partners, Thank you very much for visiting the IMMERSEKOOL boot…
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NVIDIA H100 – Two-Phase Immersion Boiler Solution

NVIDIA H100 – Two-Phase Immersion Boiler Solution

Date: Apr 24, 2026
We are pleased to introduce the next-generation thermal solution designed for AI data centers and high-performance computing environments: H100 Two-Phase Immersion Boiler Solution …
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High-Performance OCP Liquid Cooling Hose Assemblies

High-Performance OCP Liquid Cooling Hose Assemblies

Date: Apr 08, 2026
Premium EPDM hoses with stainless steel quick connectors — engineered for reliable, leak-free performance in AI data center Direct Liquid Cooling systems. Oxide Cured EPDM Stainles…
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ImmerseKool 3kW Two-Phase Immersion Cooling System

ImmerseKool 3kW Two-Phase Immersion Cooling System

Date: Mar 27, 2026
2-Phase immersion = boiling + condensation cooling Chip heat → instant vaporization → massive heat absorption Pump-free natural circulation Up to 95% more efficient than air coolin…
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EPDM UL 94 V-0 Hose for AI Data Center Liquid Cooling

EPDM UL 94 V-0 Hose for AI Data Center Liquid Cooling

Date: Mar 22, 2026
In AI data centers and semiconductor equipment, performance is defined by thermal management. This EPDM hose, rated UL 94 V-0 for flame resistance, is engineered for DLC (Direct Li…
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ORV3 Server Racks and Quick-Connect Interfaces for AI Data Centers

ORV3 Server Racks and Quick-Connect Interfaces for AI Data Centers

Date: Mar 15, 2026
IMMERSKOOL designs and manufactures advanced infrastructure for next-generation AI data centers. Our solutions include OCP ORV3 server racks and precision-engineered liquid-cooling…
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ImmerseKool Sets a New Standard in AI Data Center Cooling with Single-Phase and Two-Phase Immersion Solutions

ImmerseKool Sets a New Standard in AI Data Center Cooling with Single-Phase and Two-Phase Immersion Solutions

Date: Jan 17, 2026
As high-performance AI computing and high-density GPU environments continue to expand, cooling technology has become a critical factor in data center competitiveness. In response, …
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High-Performance Cold Plate Solutions for GPU/CPU/Accelerators

High-Performance Cold Plate Solutions for GPU/CPU/Accelerators

Date: Jan 10, 2026
To effectively manage the extreme heat generated by AI and high-performance computing (HPC), we provide optimized cold plate solutions. Customized Design: Tailored designs fully co…
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UQD Manifold Supply: Sejong 100kW Edge Data Center

UQD Manifold Supply: Sejong 100kW Edge Data Center

Date: Jan 10, 2026
ImmerseKool has successfully supplied CEJN OCP-standard UQD 02 Series couplings for the liquid cooling server racks at Korea’s largest newly-established AI data center, supporting …
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Release of -100°C Rated Quick Connectors for Quantum Computing

Release of -100°C Rated Quick Connectors for Quantum Computing

Date: Jan 10, 2026
We have launched two types of quick connects for quantum computers. These features tube connections in 3/8" and 3/4" sizes, rated for temperatures between -100°C and -150°C.
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