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IMMERSEKOOL
Liquid Cooling for AI Data Centers, EV, and Power Electronics
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Cold Plate 8 OCP / Custom Manifold 2 Hose (EPDM, etc.) 1 Quick Coupling Modules 10 Heat Sink / Boiler 14 Coolant 4 DLC Module (Cold plate hose kit) 2 Immersion Chamber (Single Phase) 3 Immersion Chamber (Two Phase) 3 CDU (In-rack / In-row) 3 POC Support Package 2
IMK-CP-001 COLD PLATE - IMK-CP-002 COLD PLAETE IMK-CP-004 COLD PLATE - IMK-CP-005 COLD PLATE I IMK-CP-AMD SP5 COLD PLAETE IMK-CP-DIMM DIMM (Memory IMK-CP-EGS EGS Cold Pla IMK-CP-PSB KIT COLD PLATE -

Cold Plate

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COLD PLATE - NVIDIA H100
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IMK-CP-001
COLD PLATE - NVIDIA H100
Main Use: NVIDIA H100 COLD PLATE
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Details

The H100 DLC cold plate is a high-performance thermal solution
based on Direct Liquid Cooling (DLC) technology, designed for high-power GPUs and AI accelerators.

It features a copper base with an aluminum frame,
providing excellent thermal conductivity and mechanical stability.

The optimized internal flow channel design ensures low thermal resistance
and high cooling efficiency, enabling stable operation under up to 575W heat loads.

Ideal for AI servers and data center applications.


ItemDescription
ApplicationGPU / AI Accelerator (H100 class)
Cooling MethodDirect Liquid Cooling (DLC)
Base MaterialCopper with aluminum frame
Dimension152.0 × 80.5 × 21.6 mm (with swivel joints)
Mass593 g
PerformanceUp to 575W
Thermal ResistanceR-ca = 0.041°C/W
Pressure Drop3.14 psi @ 1.0 LPM
CoolantWater / Water-glycol
ConnectionHose barb / quick connector
MountingScrew mount
Application FieldAI server / GPU cooling / data center